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Press Room

2010-07-13
Press Release: A fast serial world with MEN's peripheral boards for CompactPCI® PlusIO

A fast serial world with MEN's peripheral boards for CompactPCI® PlusIO

» English press release

» German press release

» Photo 300 dpi (1.78 MB)

2010-07-19
Press Release: 3U CompactPCI® Diagnosis Buffer with PowerPC® MPC8314 and FPGA

3U CompactPCI® Diagnosis Buffer with PowerPC® MPC8314 and FPGA

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.2 MB)

2010-06-14
Press Release: Triple-Redundant VMEbus SBC for Extremely Safety-Critical Applications

Triple-Redundant VMEbus SBC for Extremely Safety-Critical Applications

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.22 MB)

2010-05-27
Press Release: Intel® Atom™ Platform for Intelligent Displays

Intel® Atom™ Platform for Intelligent Displays

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.63 MB)

2010-04-22
Press Release: New MM50 ESMini™ Module – PowerPC® and Low Power Dissipation for Mobile Applications

New MM50 ESMini™ Module – PowerPC® and Low Power Dissipation for Mobile Applications

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.88 MB)

2010-03-25
Press Release: Safety Platform for Safety-Critical Applications in the Railways and Avionics Market

Safety Platform for Safety-Critical Applications in the Railways and Avionics Market

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.67 MB)

2010-03-08
Press Release: The Future has Begun: MEN’s First CompactPCI® Serial SBC G20

The Future has Begun: MEN’s First CompactPCI® Serial SBC G20

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.69 MB)

2010-02-18
Press Release: Qualified for Harsh Environments - XM1L Computer-On-Module with Intel® Atom™ XL

Qualified for Harsh Environments - XM1L Computer-On-Module with Intel® Atom™ XL

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.94 MB)

2010-01-18
Press Release: Intel® Atom™ and FPGA on 3U CompactPCI® - The Height of Robustness and Flexibility

Intel® Atom™ and FPGA on 3U CompactPCI® - The Height of Robustness and Flexibility

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.78 MB)

2009-11-23
Press Release: PICMG Releases CompactPCI® PlusIO

» English press release

» German press release

2009-11-27
Press Release: MIPIOS® Switches – Safety and Reliability in Every Application

MIPIOS® Switches – Safety and Reliability in Every Application

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.33 MB)

2009-09-23
Press Release: PMC Module with Four UART Interfaces for Fast Serial Data Transfer

PMC Module with Four UART Interfaces for Fast Serial Data Transfer

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2 MB)

2009-08-19
Press Release: MIPIOS® – The New Generation of Box Computers Revolutionizes the Mobile Market!

MIPIOS® – The New Generation of Box Computers Revolutionizes the Mobile Market!

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.94 MB)

2009-08-13
Webinar: Next Generation CompactPCI®

Webinar Topic: Vision for Next Generation CompactPCI and PICMG 2.30 Draft Standard featuring 3M Ultra Hard Metric (UHM) connectors. MEN CTO Manfred Schmitz together with speakers from 3M will give you an overview on the migration from CompactPCI to CompactPCI PlusIO and answer your questions.

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2009-07-22
Press Release: MEN Paves the Way into the Future! First PICMG 2.30 SBC with Intel® Core™ 2 Duo

MEN Paves the Way into the Future! First PICMG 2.30 SBC with Intel® Core™ 2 Duo

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.04 MB)

2009-06-30
Press Release: Certification to IRIS

Certification to IRIS

» English press release

» German press release

» Photo 300 dpi (229 KB)

2009-06-02
Press Release: PMC module with four CAN bus interfaces

PMC module with four CAN bus interfaces

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.1 MB)

2009-05-11
Press Release: ESMini™ – Ultra Small Form Factor with Intel® Atom™ and Conduction Cooling

ESMini™ – Ultra Small Form Factor with Intel® Atom™ and Conduction Cooling

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (1.72 MB)

2009-04-09
Press Release: CompactPCI® Conduction Cooling Rack for Extreme Environments

CompactPCI® Conduction Cooling Rack for Extreme Environments

» English press release

» German press release

» Product data sheet

» Photo 300 dpi (2.86 MB)

2009-03-16
ICC Media Web Video - CompactPCI® Plus - The future of CompactPCI® is serial

Manfred Schmitz is speaking about CompactPCI Plus, based on CompactPCI, an established standard for building cost-effective, reliable industrial computers. Today’s users appreciate the modularity, robustness and economic efficiency of CompactPCI. CompactPCI Plus offers all these advantages plus fast serial data transfer – including the migration path.

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2009-03-16
konstruktion.de - CompactPCI®-Technik in der Getränkeindustrie

Die miho Inspektionssysteme GmbH vereint die jüngsten Entwicklungen aus Embedded Technologie und zukunftsweisender optischer Erkennung in einem System und bietet so eine der hochrangisten Flascheninspektionsanlagen, die derzeit erhältlich sind. Dabei kommt auch CompactPCI-Technik von MEN Mikro Elektronik zum Einsatz.

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