Chipset
Northbridge: Intel® 965GME Express
Southbridge: Intel® ICH8M-E (Enhanced)
Memory
4MB L2 cache integrated in Core 2 Duo
Up to 4GB SDRAM system memory
Soldered
DDR2
667MHz memory bus frequency
Dual-channel, 2x64 bits
8Mbits boot Flash
Serial EEPROM 2kbits for factory settings
CompactFlash® card interface
Via onboard IDE
Type I
True IDE
DMA support
Mass Storage
Parallel IDE (PATA)
One IDE port for local CompactFlash®
Serial ATA (SATA)
Two channels via side-card connector, one channel via rear I/O
Transfer rates up to 300MB/s
RAID level 0/1 support
Graphics
Integrated in 965GME Express chipset
Up to 500MHz 256-bit graphics core
Maximum resolution: 2048 x 1536 pixels @ 60Hz, 32bpp reduced blanking timing (driver limited)
VGA connector at front panel
Two SDVO ports available via side-card connector
Two additional DVI connectors at front panel optional via side card
I/O
USB
Two USB 2.0 ports via Series A connectors at front panel
Four USB 2.0 ports via side-card connector
Three USB 2.0 ports via rear I/O connector J4
UHCI implementation
Data rates up to 480Mbits/s
Ethernet
One 10/100/1000Base-T Ethernet channel via RJ45 connector at front panel
Ethernet controller connected by one x1 PCIe® link
One 10/100Base-T Ethernet channel via RJ45 connector at front panel
Connected to Southbridge via LCI
One 10/100/1000Base-T Ethernet channel via rear I/O (optional)
Connected via side-card connector
Onboard LEDs to signal activity status and connection speed
High Definition (HD) audio
Accessible via side-card connector
Front Connections (Standard)
VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Miscellaneous
Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery (5 years life cycle)
Watchdog timer
Temperature measurement
One user LED
Reset button
PCI Express®
One x1 link to connect local 1000Base-T Ethernet controller
Data rate 250MB/s in each direction (2.5 Gbits/s per lane)
Four x1 links for rear I/O on J2/J3
Data rate up to 1GB/s in each direction (2.5 Gbits/s per lane)
One x1 link via side-card connector
Data rate 250MB/s in each direction (2.5 Gbits/s per lane)
CompactPCI® Express
Compliance with CompactPCI® Express PICMG EXP.0 R1.0 Specification
CompactPCI® Express connector P1 for power supply
CompactPCI® Express connectors J2 and J3 for four PCI Express® x1 links
CompactPCI® Express connector J4 for rear I/O
Electrical Specifications
Supply voltage/power consumption:
+5V (-3%/+5%), 3.22A (no load), 3.17A (load 66%), 3.16A (full load)
+12V (-10%/+10%), 0.39A (no load), 2.18A (load 66%), 2.87A (full load)
MTBF: tbd @ 40°C according to IEC/TR 62380 (RDF2000)
Mechanical Specifications
Dimensions: conforming to CompactPCI® Express specification for 3U boards
Front panel: 4HP with ejector
Weight: 420g
Environmental Specifications
Temperature range (operation):
2.2GHz Core 2 Duo T7500: 0..+60°C
Airflow: 1.5m/s
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 2,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 1g/10..150Hz
Conformal coating on request
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
BIOS
Award BIOS
Software Support
Note that 64-bit hardware technology requires 64-bit operating system support
Windows® (including Vista)
Linux
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
For more information on supported operating system versions and drivers see Software.
