Memory
2x32KB L1 data and instruction cache, 512KB/256KB L2 cache integrated in MPC8548/MPC8543
Up to 2GB SDRAM system memory
Soldered
DDR2
Up to 300 MHz memory bus frequency, depending on CPU
Up to 1GB soldered NAND Flash (and more, depending on chip availability), FPGA-controlled
32MB additional DDR2 SDRAM, FPGA-controlled, e.g. for video data and NAND Flash firmware
16MB boot Flash
128KB non-volatile FRAM
Serial EEPROM 4kbits for factory settings
Mass Storage
Parallel IDE (PATA)
One port for hard-disk drives
Available via I/O connector
FPGA-controlled
PIO mode 0 and UDMA mode 5 (UDMA100) support
Up to 1GB soldered ATA NAND Flash (and more, depending on chip availability), FPGA-controlled
Graphics
Available via I/O connector
FPGA-controlled
800 x 600, 60Hz/75Hz, 6-bit RGB
I/O
Three Ethernet channels
Three 10/100/1000Base-T Ethernet channels with MPC8548/E
Two 10/100/1000Base-T Ethernet channels with MPC8543/E
Three RJ45 connectors at front panel
Six onboard LEDs to signal LAN Link and Activity
One RS232 UART (COM1)
One RJ45 connector at front panel
Data rates up to 115.2kbit/s
16-byte transmit/receive buffer
Handshake lines: CTS, RTS; or: COM2, without any COM handshake lines
Further I/O depending on FPGA configuration
Front Connections
Three Ethernet (RJ45)
One RS232 UART COM1 (RJ45)
FPGA
Standard factory FPGA configuration:
Main bus interface
Interrupt controller, reset controller
16Z070_IDEDISK - IDE controller for NAND Flash
16Z043_SDRAM - Additional SDRAM controller (32MB DDR2)
16Z016_IDE - IDE controller (PIO mode 0 and UDMA mode 5)
16Z044_DISP - Display controller (800 x 600, 60Hz/75Hz, 6-bit RGB)
16Z031_SPI - SPI touch panel controller
16Z125_UART - UART controller (controls COM10..COM12)
16Z034_GPIO - GPIO controller (8 I/O lines, system control signals)
The FPGA offers the possibility to add customized I/O functionality. See FPGA.
PCI Interface
32-bit, 33/66-MHz PCI interface at PCI-104 connectors J1 and J2
Compliant with PCI Specification 2.2
Support of four external masters
Miscellaneous
Real-time clock
Temperature sensor, power supervision and watchdog
Electrical Specifications
Supply voltage/power consumption:
+5V (-2%/+5%), 2A typ.
+3.3V (-2%/+5%), 0.5A typ.
Mechanical Specifications
Dimensions: conforming to ESM™ specification (PCB: 149mm x 71mm), Type I-S, except height: approx. 1mm higher than standard
Weight: 108g (w/o heat sink); standard heat sink: 142g
Environmental Specifications
Temperature range (operation):
-40..+85°C (screened)
Airflow: min. 10m³/h
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 1g/10..150Hz
Conformal coating on request
MTBF
245,671h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
BIOS
MENMON™
Software Support
Linux
VxWorks®
QNX®
INTEGRITY® (Green Hills® Software) support available. Please contact Green Hills® for further information.
OS-9® (on request)
For more information on supported operating system versions and drivers see Software.
