Chipset
Northbridge: Intel® 945GM Express or Intel® 945GME Express
Southbridge: Intel® ICH7-M DH
Memory
4MB L2 cache integrated in Core 2 Duo
Up to 4GB SDRAM system memory
Soldered
DDR2
667MHz memory bus frequency
Dual-channel, 2x64 bits
8Mbits boot Flash
Serial EEPROM 2kbits for factory settings
CompactFlash® card interface
Via onboard IDE
Type I
True IDE
DMA support
Mass Storage
Parallel IDE (PATA)
One IDE port for local CompactFlash®
Serial ATA (SATA)
Two channels via side-card connector
Transfer rates up to 150MB/s
RAID level 0/1 support
Graphics
Integrated in 945GM Express chipset
200/250MHz 256-bit graphics core
VGA connector at front panel
Two SDVO ports available via side-card connector
Two additional DVI connectors at front panel optional via side card
Simultaneous connection of two monitors
I/O
USB
Two USB 2.0 ports via Series A connectors at front panel
Four USB 2.0 ports via side-card connector
Two USB 2.0 ports via rear I/O on request
UHCI implementation
Data rates up to 480Mbit/s
Ethernet
Two 10/100/1000Base-T Ethernet channels
RJ45 connectors at front panel
Ethernet controllers are connected by two x1 PCIe® links
Onboard LEDs to signal activity status and connection speed
High Definition (HD) audio
Accessible via side-card connector
Front Connections (Standard)
VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Miscellaneous
Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery
Watchdog timer
Temperature measurement
One user LED
Reset button
PCI Express®
Two x1 links to connect local 1000Base-T Ethernet controllers
Data rate 250MB/s in each direction (2.5 Gbit/s per lane)
One x4 or four x1 links for extension through side-card connector
Data rate up to 1GB/s in each direction (2.5 Gbit/s per lane)
CompactPCI® Bus
Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
CompactPCI® Express support (EXP.0 R1.0)
System slot
32-bit/33-MHz CompactPCI® bus
V(I/O): +3.3V (+5V tolerant)
Busless Operation
Board can be supplied with +5V only, all other voltages are generated on the board
Backplane connectors used only for power supply
Electrical Specifications
Supply voltage/power consumption:
+5V (-3%/+5%), approx. 8.8A (5.4A with L7400 processor)
+3.3V (-3%/+5%), approx. 1.1A
+12V (-10%/+10%), approx. 10mA
If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on the board and fed to the backplane (3A max.)
MTBF: 245,573h @ 40°C according to IEC/TR 62380 (RDF2000)
Mechanical Specifications
Dimensions: conforming to CompactPCI® specification for 3U boards
Front panel: 4HP with ejector
Weight: 427g
Environmental Specifications
Temperature range (operation):
2.16GHz Core 2 Duo T7400: 0..+60°C
Conditions: airflow 1.5m/s, typical power dissipation 33W, with Windows® XP operating system, 1 Gb Ethernet and hard disk, without CPU clock reduction
1.5GHz Core 2 Duo L7400: 0..+60°C
Conditions: airflow 1.5m/s, typical power dissipation 22W, with Windows® XP operating system, 1 Gb Ethernet and hard disk, without CPU clock reduction
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 2g/10..150Hz
Conformal coating on request
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
BIOS
Award BIOS
Software Support
Windows®
Linux
VxWorks®
QNX®
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
For more information on supported operating system versions and drivers see Software.
