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The D9 6U single-board computer supports a variety of Intel® Core™ Duo and Core 2 Duo processors from the high-end 2.16 GHz T7400 to the low-voltage dual-core versions down to a selection of Celeron® M types. It is designed especially for embedded systems which require high computing and graphics performance and low power consumption.
(continued)
The CPU card offers a 32-bit/33-MHz system slot CompactPCI® bus interface or can be used without a bus system.
A total of five PCI Express® lanes for high-speed communication (such as Gb Ethernet) are supported on the D9. 2 x1 PCIe® links are used for the two onboard Ethernet interfaces, another 2 x1 links support the XMC slot and 1 x1 link is available on a specific mezzanine card.
Further serial interfaces include two SATA ports for connection of an onboard hard disk (instead of the PMC or XMC) and a second one on the transition module at the rear. Alternatively, one of the two SATA ports is available via the mezzanine card. One PATA interface supports the onboard CompactFlash® slot.
A total of six USB 2.0 are supported at the front, on the rear I/O transition module and on board the mezzanine card. Four of the onboard USBs can be used to realize two UARTs on a mezzanine card and another two UARTs on the rear I/O transition module.
The standard I/O available at the front panel of the D9 includes graphics on a VGA connector, two Gigabit Ethernet and two USB 2.0 interfaces.
The D9 can be extended by different mezzanine cards. Additional functions may include PICMG 2.16, digital video outputs for flat panel connection via DVI, different UARTs, USB 2.0 ports, SATA for hard disk or RAID connection and HD audio.
The D9 is also prepared for rear I/O via the CT7 transition module with two USB 2.0, 2 UARTs, 2 Gigabit Ethernet, 1 SATA and 1 PIM module.
Supervision of the processor and board temperature as well as a watchdog for monitoring the operating system complete the functionality of the D9.
The D9 operates in Windows® and Linux environments and under RTOS systems that support multi-core architecture.
Equipped with Intel® components exclusively from the Intel® Embedded Line, the D9 has a guaranteed minimum standard availability of 5 years.
The D9 is suited for a wide range of industrial applications, e.g. monitoring, vision and control systems as well as test and measurement. Main target markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.
For use in harsh environments the D9 is equipped with soldered DDR2 DRAM (up to 4GB) to guarantee optimum shock and vibration resistance. It comes with a tailored passive heat sink within 4 HP height. However, forced air cooling is always required inside the system. Its robust design make the D9 especially suited for rugged environments with regard to extended operation temperature, shock and vibration according to applicable DIN, EN or IEC industry standards. It is also ready for coating for use in humid and dusty environments.


CPU
Up to Intel® Core™ 2 Duo T7400
Dual-core 64-bit processor
Up to 2.16GHz processor core frequency
Up to 667MHz front-side bus frequency
(continued)
Chipset
Northbridge: Intel® 945GME Express
Southbridge: Intel® ICH7-M DH
Memory
4MB L2 cache integrated in Core 2 Duo
Up to 4GB SDRAM system memory
Soldered
DDR2
667MHz memory bus frequency
Dual-channel, 2x64 bits
8Mbits boot Flash
Serial EEPROM 2kbits for factory settings
CompactFlash® card interface
Via onboard IDE
Type I
True IDE
DMA support
Mass Storage
Parallel IDE (PATA)
One IDE port for local CompactFlash®
Serial ATA (SATA)
One channel for onboard hard disk
One channel via mezzanine card connector or rear I/O connector
Transfer rates up to 150MB/s
RAID level 0/1 support
Graphics
Integrated in 945GME Express chipset
200/250MHz 256-bit graphics core
VGA connector at front panel
Two SDVO ports available via mezzanine-card connector
One additional DVI connector at front panel optional via mezzanine card
I/O
USB
Two USB 2.0 ports via Series A connectors at front panel
Four USB 2.0 ports via mezzanine-card connector (if a transition module is used two of these are converted to UARTs)
Two USB 2.0 ports via rear I/O (if these are used only two USB are available on the mezzanine card connector)
UHCI implementation
Data rates up to 480Mbit/s
Ethernet
Two 10/100/1000Base-T Ethernet channels at front panel
RJ45 connectors at front panel
Ethernet controllers are connected by two x1 PCIe® links
Onboard LEDs to signal activity status and connection speed
Two 10/100/1000Base-T Ethernet channels via mezzanine card on backplane (PICMG 2.16 or on transition module)
Via one x1 PCIe® link and without LEDs
High Definition (HD) audio
Accessible via mezzanine-card connector
Front Connections
VGA
Two USB 2.0 (Series A)
Two Ethernet (RJ45)
Rear I/O
USB 2.0, two ports
UART
Two ports instead of two USB on mezzanine card connector
PMC rear I/O
Ethernet 1000Base-T via mezzanine card, two ports (only with D700)
Mezzanine Slot
One slot usable for PMC or XMC
XMC slot
Compliant with XMC standard VITA 42.3-200x
Two x1 PCI Express® links
PMC slot
Compliant with PMC standard IEEE 1386.1
PCI / PCI-X 32/64 bit, 33/66/133MHz, 3.3V V(I/O)
One x1 PCI Express® link via PCI Express® to PCI bridge
PMC I/O module (PIM) support via J14
Miscellaneous
Board controller
Real-time clock, buffered by a GoldCap or alternatively a battery
Watchdog timer
Temperature measurement
One user LED
Reset button
PCI Express®
Two x1 links to connect local 1000Base-T Ethernet controllers
One x1 link for extension through mezzanine-card connector
Two x1 links to connect XMC (or one x1 link for connection of PMC via PCI Express® to PCI bridge)
Data rate up to 250MB/s in each direction (2.5 Gbit/s per lane)
CompactPCI® Bus
Compliance with CompactPCI® Core Specification PICMG 2.0 R3.0
System slot
32-bit/33-MHz CompactPCI® bus
V(I/O): +3.3V (+5V tolerant)
Compliance with CompactPCI® Packet Switching Backplane PICMG 2.16 R1.0
Busless Operation
Backplane connectors used only for power supply
Electrical Specifications
Supply voltage/power consumption:
+5V (-3%/+5%), approx. 8.9A (9.8A with 5V only supply)
+3.3V (-3%/+5%), approx. 1.25A
+12V (-10%/+10%), approx. 10mA (without PMC or XMC module)
If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on the board and fed to the backplane (3A max.)
Mechanical Specifications
Dimensions: conforming to CompactPCI® specification for 6U boards
Front panel: 4HP with ejector
Weight:
Without XMC/PMC and mezzanine board: 400g
With XMC/PMC and mezzanine board: 530g
Environmental Specifications
Temperature range (operation):
0..+45°C
0..+60°C (version with Celeron® M processor)
Airflow: min. 15m³/h (1.5m/s)
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/ 10..150Hz (EN 60068-2-6)
Conformal coating on request
MTBF
182,199h @ 40°C according to IEC/TR 62380 (RDF2000)
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 Class A (radio disturbance), EN 61000-4-2 (ESD), EN 61000-4-4 (burst) and EN 61000-4-5 (surge)
BIOS
Award BIOS
Software Support
Windows®
Linux
VxWorks® (on request)
QNX® (on request)
Intel® Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
For more information on supported operating system versions and drivers see Software.


CPU
Core 2 Duo T7400, 2.16GHz
(continued)
Core 2 Duo L7400, 1.5GHz LV
Core Duo T2500, 2GHz
Core Duo L2400, 1.66GHz LV
Core Duo U2500, 1.2GHz ULV
Celeron® M 423, 1.06 GHz
Memory
System RAM
256 MB, 512 MB, 1 GB, 2 GB or 4 GB
CompactFlash®
0 MB up to maximum available
Graphics
One DVI-D connector at front via mezzanine card
I/O
Ethernet
9-pin D-Sub connector with one or two 10/100Base-T ports instead of two RJ45 connectors
Active Management Technology for remote service
I/O with mezzanine card
One RS232 UART interface via RJ45
Rear I/O
One SATA channel (instead of the mezzanine card channel)
Two COM via USB-to-UART bridges (instead of two USB on the mezzanine card connector)
Two SDVO ports via mezzanine card
Four USB ports via mezzanine card
Two Ethernet via mezzanine card (PICMG 2.16 or on transition module)
HD Audio via mezzanine card
One x1 PCIe® link via mezzanine card
Battery on CT7 transition module
Please note that some of these options may only be available for large volumes. Please ask our sales staff for more information.


| Article No. | Description |
| 02D009-00 | Intel® Core™ 2 Duo T7400, 2.16 GHz, 2 GB DDR2 DRAM, 0..+45°C |


| Article No. | Description | More |
| 02D700-00 | 1 DVI, 1 COM, PICMG 2.16 (2 Gb Ethernet) for D9, A19 and compatible cPCI and VME SBCs, 0..+55°C | More info |
| 08CT07-00 | CompactPCI® rear I/O transition module 6U/80mm, 2 Gb Ethernet, 2 USB 2.0, 2 COMs, 1 PIM slot, 1 CompactFlash® slot, connecting to D9, 0..+60°C | More info Photo |


| Article No. | Description |
| 0751-0042 | CompactFlash® card, 4 GB, Type I, fixed bit set, -40..+85°C |
| 0751-0053 | CompactFlash® card, 2 GB, Type I, fixed bit set, -40..+85°C |
| 0751-0055 | CompactFlash® card, 8 GB, Type I, fixed bit set, -40..+85°C |


| Article No. | Description | More |
| MEN delivers turn-key systems completely installed (hardware, operating system, accessories), wired and tested. Different rack sizes, power supplies and backplanes on request. For details please contact your local sales representative. | ||
| 0701-0030 | CompactPCI® 19" 3U/84HP rack-mount enclosure for 6U cards (horizontal), 6-slot backplane, system slot left (bottom), 250W ATX wide-range PSU, 2 fans, prepared for rear I/O | More info Photo |


| Article No. | Description | More |
| OS independent | ||
| 13Y001-06 | MDIS5™ low-level driver sources (MEN) for LM63 on SMBus for F14, F15, F17, F18, D9, D601, A19 and A20 Requires an MDIS4™/2004 or MDIS5™ system package | Download Details |
| 13Y002-06 | MDIS5™ low-level driver sources (MEN) for F14, F15, F17, F18, D9, D601, A19 and A20 board monitoring Requires an MDIS4™/2004 or MDIS5™ system package | Download Details |
| 13Y004-06 | MDIS5™ low-level driver sources (MEN) for generic SMBus driver for F14, F15, F17, F18, F19P, F21P, G20, D9, D601, F600 and F601, A19, A20 and F217 Requires an MDIS4™/2004 or MDIS5™ system package | Download Details |
| 13Y007-06 | MDIS5™ low-level driver sources (MEN) for F14, F15, F17, F18, D9, D601, A19 and A20 board controller Requires an MDIS4™/2004 or MDIS5™ system package | Download Details |
| Linux | ||
This product is designed to work under Linux. See below for potentially available separate software packages from MEN. | ||
This product is designed to work under ELinOS Embedded Linux by Sysgo. For more information and product support please contact www.sysgo.com. | ||
| Windows | ||
This product is designed to work under Windows®. See below for potentially available separate software packages from MEN. | ||
| 13F014-77 | Windows® Installset (MEN) for F14, F15, F17, F18, D9, D601, A19 and A20Includes all free drivers developed by MEN for the supported hardware. | Download w/o System Package Download with System Package Details |
| 13T001-70 | Windows® network driver (Intel®) for F14, F15, F17, F18, D9, D6, D7, D601, A19, A20 and P601, P602 | Download Details |
| 13T003-70 | Windows® chipset driver (Intel®) for F14, F15, F17, F18, F18E, F19P, D9, D6, D7, D601, A19 and A20 | Download Details |
| 13T005-70 | Windows® USB2UART driver (FTDI) for F14, F15, F17, F18, F19P, D9, A19, A20, XM2 and XM50 / XM51 / F50P / F50C hosts | Download Details |
| 13T006-70 | Windows® HD Audio driver (Realtek) for F14, F15, F17, F18, D9 and A19 | Download Details |
| 13T007-70 | Windows® chipset graphics driver (Intel®) for F15, F17, D9, A19 and A20 | Download Details |
| VxWorks | ||
This product is designed to work under VxWorks®. For details regarding supported/unsupported board functions please refer to the corresponding software data sheets. | ||
| 10F015-60 | VxWorks® BSP (MEN) for F15, F17 and D9 | Download Details |
| 13Y003-60 | VxWorks® driver (MEN) for USB-to-UART bridges on F600, F601, F602, F603, F604 and F606 | Download Details |
| QNX | ||
This product is designed to work under QNX®. For details regarding supported/unsupported board functions please refer to the corresponding software data sheets. | ||
| 10F014-40 | QNX® 6.3.0 installation support files (QNX® and MEN) for F14, F15, F17, F18, F19P, XM1, XM2 and MM1 | Download Details |
| Firmware/BIOS | ||
This product includes a specially adapted BIOS. | ||
| 14F015-00 | System BIOS for F15, F17 and D9 | Download Details |
| Miscellaneous | ||
Intel® software development products such as analyzers, compilers, threading tools etc. can be downloaded under www.intel.com/cd/software/products/asmo-na/eng/index.htm. IA-32 Intel® Architecture Software Developer's Manuals are available under www.intel.com/products/processor/manuals/index.htm. | ||
For operating systems not mentioned here contact MEN sales.



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