Compliant with M-Module™ standard
Characteristics: A08, A24, D08, D16, D32, INTA, TRIGI, TRIGO
Peripheral Connections
Via front panel
CompactPCI® Bus
Compliance with CompactPCI® Specification 2.0 R2.1
Only one slot required on the 3U CompactPCI® bus
32-bit/33-MHz PCI-to-M-Module™ bridge
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FPGA-based
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Compliant with PCI Specification 2.2
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Target on PCI bus
V(I/O): +5V (+3.3V on request)
Electrical Specifications
Supply voltage/power consumption:
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+5V (-3%/+5%), 20mA typ.
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+3.3V (-3%/+5%), 20mA typ.
MTBF: 1,046,000h @ 40°C (derived from MIL-HDBK-217F)
Mechanical Specifications
Dimensions: conforming to CompactPCI® specification for 3U boards
Front panel: aluminum with 1 handle, cut-out for front connector of M-Module™
Weight: 130g (without M-Modules™)
Environmental Specifications
Temperature range (operation):
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0..+60°C or -40..+85°C
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Airflow: min. 10m³/h
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 2g/10..150Hz
Conformal coating on request
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
Software Support
M-Module™ drivers for Windows®, VxWorks®, Linux, QNX®, OS-9® as supported
