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Apr 16, 2019

Rugged COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC

Nuremberg, Germany – April 16, 2019. The CB71C is an ultra-rugged COM Express module for rail, public transportation and industry applications, e.g. data acquisition, infotainment, transcoding and live 3D. It is 100% compatible with COM Express Type 6 Pin-Out and conforms to the VITA 59 standard, which specifies robust mechanics to ensure reliable operation even under the harshest environmental conditions.

  • AMD Ryzen™ Embedded V1000/R1000 series
  • Up to 32 GB DDR4 RAM with ECC
  • Up to 4 Digital Display Interfaces (DP, eDP, HDMI, DVI)
  • Hardware memory encryption
  • Safety-relevant supervision functions
  • Virtualization
  • The Ryzen Embedded V1000 powered products support up to -40°C to +85°C Tcase, conduction cooling
  • VITA 59 in process, compliant with COM Express Basic, type 6
  • PICMG COM.0 COM Express version also available

Extremely Robust, Powerful Graphics and High Performance

The CB71C Rugged COM Express Module is based on the AMD Ryzen Embedded family and can now be equipped with the new Ryzen™ Embedded R1000 SoC in addition to the Ryzen Embedded V1000 SoC. The new AMD Ryzen Embedded R1000 SoC features a Radeon™ Vega graphics engine with three compute units and support for up to three displays with a resolution of up to 4k without additional graphics hardware. With up to four powerful "Zen" processor cores, when using the AMD Ryzen Embedded V1000 SoC, the CB71C is also suitable for virtualization.

With the AMD Ryzen Embedded family, the COM module gains valuable flexibility: The design can be based on either a Ryzen Embedded R1000 dual-core SoC or a Ryzen Embedded V1000 quad-core SoC. The strength of the new AMD Ryzen Embedded R1000 SoC lies in its low power consumption combined with its high single-thread performance and high clock with dual core and quad thread performance.

The modules with AMD Ryzen Embedded V1000 provide passive cooling and a temperature range from -40°C to +85°C are possible with the low-power versions. The CB71C can be equipped with up to 32 GB directly soldered DDR4 main memory and a 16 GB eMMC. PCI Express 3.0, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0 are available as high-speed interfaces.

The COM module has a board management controller with monitoring functions and a trusted platform module. The module also uses the Secure Memory Encryption capability in the AMD Ryzen Embedded R1000 SoC – an essential feature for security-critical applications such as payment and ticketing terminals, fleet management or monitoring.

AMD welcomes MEN's decision to implement the new product family with AMD Ryzen Embedded:

“We are excited to continue our work with MEN and see them develop fantastic devices and modules that take advantage of the features in the AMD Ryzen Embedded family,” said Stephen Turnbull, director of product management and business development, Embedded Solutions, AMD. “MEN develops systems with the highest demands on robustness and safety and the AMD Ryzen Embedded R1000 and AMD Ryzen Embedded V1000 help make those features a reality for MEN’s customers.” 


MEN press documents are archived on this web site for historical purposes. Information in the documents is accurate at the time of release. However, product specifications and other specific information may change over time. Some information about product pricing and availability may be limited to specific geographic areas and may differ in other areas. Information as stated in the document may or may not be in effect after the date of the release.In addition, press documents may contain statements that are forward-looking. These statements are based on current expectations as of the date of a particular release. Actual results may differ materially from those projected because of a number of risks and uncertainties.

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