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ME1 - DIN-Rail Computer Extension Module: Wireless Communication

Network Connectivity for Embedded Computer Systems

DIN Rail fully modular component for wireless networks in IoT, security, passenger information systems, predictive maintenance and diagnostics.

Download data sheet

  • ME1 Product ImageME1 - DIN-Rail Wireless Communication Module
  • ME1 Product Image

Main Features

  • LTE Advanced via M.2
  • 4 micro-SIM card slots
  • WLAN via PCIe Mini Card
  • GNSS receiver
  • Conduction cooling of modems
  • DIN rail, wall or 19" rack mounting
  • -40 °C to +70 °C (+85 °C), fanless
ME1 Product Image

Technical Data

Wireless Functionality
Possible wireless functions:
  • GNSS, LTE, WLAN
Interfaces
  • This product includes interface options
    • Different wireless functions depending on assembled wireless interface cards
  • Wireless
    • GNSS antenna connector: 1x, SMA receptacle
  • M.2 Card
    • 2x M.2 Card slot
    • Slot 1: M.2 3042 (LTE) socket 2 Key B, USB 2.0, USB 3.0
    • Slot 2: M.2 3042 (LTE) socket 2 Key B, USB 2.0, USB 3.0
  • PCI Express Mini Card
    • 1x PCI Express Mini Card slot
    • PCIe Full-Mini; PCIe x1, USB 2.0
  • SIM card
    • 4x micro-SIM card slot, externally accessible
  • LED
    • Status: power status
    • User configurable: 3x
  • Cutout
    • Antenna connector options: SMA receptacle, RP-SMA receptacle
Electrical Specifications
Power consumption
  • 8 W typ.
Mechanical Specifications
  • Dimensions
    • (W) 38 mm, (D) 144 mm, (H) 132 mm
  • Weight: 450 g approx.
  • Mounting possibilities
    • DIN rail
    • Wall-mount
    • Rack-mount in 19" cabinet
  • Cooling
    • Air cooling, natural convection, airflow 0.4 m/s
  • Protection rating
    • IP20
Product Compliance: Rail - Rolling Stock
  • Operating temperature: -40 °C to +70 °C, +85 °C for 10 min (EN 50155:2017, class OT4, ST1)
  • Rapid temperature variations: EN 50155:2017, class H1, no requirements
  • Storage temperature: -40 °C (EN 50155:2017) to +85 °C (EN 60068-2-2, Bb)
  • Altitude: +3000 m max. (EN 50125-1:2014, class AX)
  • Pollution degree: EN 50124-1:2017, class PD3
  • Humidity: +55 °C and +25 °C, 100 % RH max. (EN 50155:2017)
  • Shock: 30 ms @ 50 m/s² (EN 61373:2010/AC:2017-09, vehicle body, cat. 1, class B)
  • Vibration: 10 min @ 2.02 m/s² and 5 h @ 11.44 m/s² (long-life) (EN 61373:2010/AC:2017-09, vehicle body, cat. 1, class B x 2)
  • Electrical safety
    • EN 50155:2017
    • EN 50153:2014 + A1:2017
    • EN 50124-1:2017
    • EN ISO 13732-1:2008
  • Fire protection: EN 45545-2:2013 + A1:2015, HL3
  • EMC emission
    • EN 50121-3-2:2016
    • Regelung Nr. EMV 06 :2014-07-29, Anhang E: Messung an Geräten
  • EMC immunity: EN 50121-3-2:2016
  • Useful life: 20 years (EN 50155:2017, class L4)
  • Protective coatings: EN 50155:2017, class PC2 (Any PCB protected on both sides)
Product Compliance: Rail - Wayside Non-Safety Related
  • Operating temperature: -40 °C to +70 °C (EN 50125-3:2003, class T2, cubicle, with class T2 maximum extended by 5 °C)
  • Storage temperature: -40 °C (EN 60068-2-1:2007, Ab) to +85 °C (EN 60068-2-2:2007, Bb)
  • Altitude: +3000 m max. (EN 50125-3:2003, class AX)
  • Humidity: 100 % max. (EN 50125-2:2002, control cabinet, class T1/T2/TX)
  • Shock: 11 ms @ 20 m/s² (EN 50125-3:2003, in a switch cabinet 1 m to 3 m from the track)
  • Vibration: EN 50125-3:2003, in a switch cabinet 1 m to 3 m from the track
  • Electrical safety
    • EN 50124-1:2017
    • EN 62368-1:2014 + AC:2015
  • EMC emission
    • EN 50121-4:2016
    • EN 61000-6-4:2007 + A1:2011
  • EMC immunity
    • EN 50121-4:2016
    • EN 61000-6-2:2005
Product Compliance: Road Vehicle
  • EMC emission: ECE R10 Rev.5
  • EMC immunity: ECE R10 Rev.5
Product Compliance: Information Technology Equipment
  • Operating temperature: 0 °C (EN 60068-2-1:2007, Ae, temperature value in compliance with 6.6 b) to +60 °C (EN 60068-2-2:2007, Be)
  • Storage temperature: -40 °C (EN 60068-2-1:2007, Ab) to +85 °C (EN 60068-2-2:2007, Bb)
  • Humidity: +55 °C and +25 °C, 90 % to 100 % RH (EN 60068-2-30:2005, Db)
  • Electrical safety
    • EN 62368-1:2014 + AC:2015
  • EMC emission
    • EN 55032:2015 (multimedia equipment), class A (industrial environments)
    • EN 61000-3-2:2014
    • EN 61000-3-3:2013
  • EMC immunity
    • EN 55024:2010 + A1:2015 (information technology equipment)
Product Compliance: Radio Equipment
EMC basic compliance: The product is prepared to comply with the Radio Equipment Directive 2014/53/EU (RED). Standards compliance depends on the assembled radio (wireless) device.
Reliability
MTBF: 2 166 000 h predicted @ 40 °C according to IEC/TR 62380 (RDF 2000)
Software Support
  • Linux
    • Supported kernel: 4.8 or higher. For older kernels (e.g., 4.4.x), patches for the Apollo Lake platform are also available.
    • Yocto BSP
    • Tested with: Yocto BSP (Sumo 2.5, Linux kernel 4.15)
  • Windows
    • Windows 10 IoT Enterprise 64-bit
  • For more information on supported operating system versions and drivers see Software.

Ordering Information

Standard ME1 Models

This product has configuration options. Please contact MEN for details.

06ME01-10

Modular extension, wireless communication, GNSS, 2x M.2 Slot for LTE function, PCI Express Mini Card Slot for WLAN function, -40 °C to +70 °C (+85 °C)

PCI Express Mini Cards
6100-0336

Sierra Wireless EM7455, M.2 LTE Advanced Cat 6 modem, -40 °C to +85 °C, SKU1103582

0799-0006
0799-0006

WLAN PCI Express Mini Card DNXA-116, operating temperature -40 °C to +85 °C
For the module's driver contact MEN's support team.

This product has configuration options. Please contact MEN for details.

Software

Linux
10MC50-90

Linux Yocto BSP (MEN) for MC50M/MC50I and related ME Modules, for creation of boot media for first tests
Note: Final system configurations may require additional software or a different Linux environment according to the application requirements.

Windows
13Y021-70

Windows ERTC/SMB support package

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