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CB70C - Rugged COM Express Module with Intel Core i3 / i5 / i7
COM Express Basic, Type 6
This product has been discontinued.The CB70C is an x86 PC based Rugged COM Express type 6 module for industrial automation, medical computers, in-vehicle computers, and embedded computers in transportation, featuring the 3th generation Ivy Bridge Intel Core family up to the i7-3615QE processor. The CB70C supports conductive cooling technology and is 100% EMC proof.
CB70C Rugged COM Express (VITA 59 RCE) with Intel Core i7
Ultra-Rugged COM Express Basic Module inside Rugged COM Express Frame and Cover
CB70C Rugged COM Express Basic module on Rugged COM Express frame and cover
CB70 COM Express model
Main Features
- Intel Core i7, 3rd generation
- Quad-core 64-bit processor
- Up to 16 GB DDR3 DRAM, ECC, soldered
- Board Management Control
- Active Management Technology
- Open CL 1.1 support
- 9 V to 16 V extended input range
- -40°C to +85°C Tcase, depending on processor
- Conduction cooling
- VITA 59 in process, compliant with COM Express Basic, type 6
- PICMG COM.0 COM Express version also available
Technical Data
- The following CPU types are supported:
- Intel Core i7 (3rd gen)
- Intel Core i5 (3rd gen)
- Intel Core i3 (3rd gen)
- Intel Celeron (2nd or 3rd gen)
- Chipset
- Intel Core i7-3612QE (QM77 Platform Controller Hub (PCH))
- For more details please see the overview matrix of supported processor types.
- System RAM
- Soldered DDR3
- 2 GB, 4 GB, 8 GB or 16 GB
- Boot Flash
- 16 MB
- Integrated in processor and chipset
- Maximum resolution: 2560 x 1600 pixels
- Available via COM Express connectors
- Video
- One x16 link (PCI Express graphics)
- One VGA
- Three DDI ports for DP, HDMI, DVI, SDVO
- One LVDS dual channel up to 48-bit RGB
- Audio
- HD audio
- Serial ATA (SATA)
- Two ports with SATA Revision 2.x support; transfer rates up to 300 MB/s (3 Gbit/s)
- Two ports with SATA Revision 3.x support; transfer rates up to 600 MB/s (6 Gbit/s)
- RAID level 0/1/5/10 support
- USB
- Four USB 3.0 host ports, xHCI implementation, data rate up to 5 Gbit/s
- Four USB 2.0 host ports, EHCI implementation, data rates up to 480 Mbit/s
- Ethernet
- One 10/100/1000Base-T Ethernet channel
- Three LED signals for LAN link, activity status and connection speed
- PCI Express
- Seven x1 links (up to 500 MB/s in each direction), PCIe 2.x (5 Gbit/s per lane)
- GPIO
- 8 lines
- SMBus interface
- LPC
- SPI
- Speaker
- Input voltage supervision
- Power sequencing
- Board monitoring
- Watchdog
- Accessible via SMBus
- Real-time clock, with supercapacitor or battery backup on the carrier board
- CB70C: VITA 59 RCE: Rugged COM Express in process
- With conduction cooling cover and frame
- Rugged COM Express Basic, Module Pin-out Type 6
- CB70: PICMG COM.0 COM Express Module Base Specification
- Without conduction cooling wings, without cover and frame
- COM Express Basic (135 mm x 105 mm), Module Pin-out Type 6
- Supply voltage
- +12V (9 to 16 V)
- +5V (-5%/+5%) standby voltage
- Power consumption
- 48 W typ./ 70 W max.
- 1.1 W in standby operation
- Dimensions:
- 135 mm x 105 mm x 18 mm (height) (conforming to VITA 59 RCE Basic format), PCB mounted between a cover and a frame (model 15CB70C00/15CB70C01)
- 125 mm x 95 mm (conforming to PICMG COM.0 COM Express Basic format) (model 15CB70-00)
- Weight:
- 460 g (model 15CB70C00/15CB70C01)
- 90 g (model 15CB70-00)
- Temperature range (operation): -40..+85°C Tcase (Rugged COM Express cover/frame)
- Temperature range (storage): -40..+85°C
- Cooling Concept
- Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in process
- Air-cooled versions according to PICMG COM.0 COM Express standard
- Relative humidity (operation): max. 95% non-condensing
- Relative humidity (storage): max. 95% non-condensing
- Altitude: -300 m to +3000 m
- Shock: 50 m/s², 30 ms (EN 61373)
- Vibration (function): 1 m/s², 5 Hz - 150 Hz (EN 61373)
- Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 61373)
- 415 714 h @ 40°C according to IEC/TR 62380 (RDF 2000)
- UL 94 V-0
- EMC behavior depends on the system and housing surrounding the COM Express module.
- The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
- EN 55022 (radio disturbance)
- IEC 61000-4-2 (ESD)
- IEC 61000-4-3 (electromagnetic field immunity)
- IEC 61000-4-4 (burst)
- IEC 61000-4-5 (surge)
- IEC 61000-4-6 (conducted disturbances)
- Windows
- Linux
- For more information on supported operating system versions and drivers see Software.
Ordering Information
Software
Linux MDIS5 System (and Device Driver) Package (MEN) for Linux.
This software package includes most standard device drivers available from MEN.
MDIS5 low-level driver sources (MEN) for generic SMBus driver
MDIS5 low-level driver sources (MEN) for board management controller on MEN Intel CPUs
Linux driver (MEN) for RX8581/RX-8574 real-time clock for all products with an additional RTC component. Please note that this driver is already included in upstream Linux kernels starting from 3.14!
Windows Windows Embedded Standard 7 BSP
Windows 7/8 64-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S
Windows 7/8 32-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S
Windows Intel Management Engine Driver (Intel) for G22, F22P and CB70C
Windows 64-bit network driver (Intel)
Windows 32-bit network driver (Intel)
Windows ERTC/SMB support package
Windows chipset driver (Intel) for F14, F15, F17, F18, F18E, F19P, F21P, F22P, G20, G22, XM2, CB70C, D9, D6, D7, D601, A19 and A20
MEN Firmware Update Package (Intel Management Engine) for A22, BC70M, BL70E, BL70S, BL70W, CB70, CB70C, F22P, F22C, G22, G22C, MH70I
System BIOS for CB70C and CB70
Documentation
Application Examples
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