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CB70C - Rugged COM Express Module with Intel Core i3 / i5 / i7

COM Express Basic, Type 6

This product has been discontinued.

The CB70C is an x86 PC based Rugged COM Express type 6 module for industrial automation, medical computers, in-vehicle computers, and embedded computers in transportation, featuring the 3th generation Ivy Bridge Intel Core family up to the i7-3615QE processor. The CB70C supports conductive cooling technology and is 100% EMC proof.

Download data sheet

  • CB70C Product ImageCB70C Rugged COM Express (VITA 59 RCE) with Intel Core i7
  • CB70C Product ImageUltra-Rugged COM Express Basic Module inside Rugged COM Express Frame and Cover
  • CB70C Product ImageCB70C Rugged COM Express Basic module on Rugged COM Express frame and cover
  • CB70C Product ImageCB70 COM Express model
  • CB70C Product Image
  • CB70C Product Image
  • CB70C Product Image
  • CB70C Product Image

Main Features

  • Intel Core i7, 3rd generation
  • Quad-core 64-bit processor
  • Up to 16 GB DDR3 DRAM, ECC, soldered
  • Board Management Control
  • Active Management Technology
  • Open CL 1.1 support
  • 9 V to 16 V extended input range
  • -40°C to +85°C Tcase, depending on processor
  • Conduction cooling
  • VITA 59 in process, compliant with COM Express Basic, type 6
  • PICMG COM.0 COM Express version also available
CB70C Product Image

Technical Data

  • The following CPU types are supported:
    • Intel Core i7 (3rd gen)
    • Intel Core i5 (3rd gen)
    • Intel Core i3 (3rd gen)
    • Intel Celeron (2nd or 3rd gen)
  • Chipset
    • Intel Core i7-3612QE (QM77 Platform Controller Hub (PCH))
  • For more details please see the overview matrix of supported processor types.
  • System RAM
    • Soldered DDR3
    • 2 GB, 4 GB, 8 GB or 16 GB
  • Boot Flash
    • 16 MB
  • Integrated in processor and chipset
  • Maximum resolution: 2560 x 1600 pixels
Onboard Interfaces
  • Available via COM Express connectors
  • Video
    • One x16 link (PCI Express graphics)
    • One VGA
    • Three DDI ports for DP, HDMI, DVI, SDVO
    • One LVDS dual channel up to 48-bit RGB
  • Audio
    • HD audio
  • Serial ATA (SATA)
    • Two ports with SATA Revision 2.x support; transfer rates up to 300 MB/s (3 Gbit/s)
    • Two ports with SATA Revision 3.x support; transfer rates up to 600 MB/s (6 Gbit/s)
    • RAID level 0/1/5/10 support
  • USB
    • Four USB 3.0 host ports, xHCI implementation, data rate up to 5 Gbit/s
    • Four USB 2.0 host ports, EHCI implementation, data rates up to 480 Mbit/s
  • Ethernet
    • One 10/100/1000Base-T Ethernet channel
    • Three LED signals for LAN link, activity status and connection speed
  • PCI Express
    • Seven x1 links (up to 500 MB/s in each direction), PCIe 2.x (5 Gbit/s per lane)
  • GPIO
    • 8 lines
  • SMBus interface
  • LPC
  • SPI
  • Speaker
Supervision and Control
  • Input voltage supervision
  • Power sequencing
  • Board monitoring
  • Watchdog
  • Accessible via SMBus
  • Real-time clock, with supercapacitor or battery backup on the carrier board
Computer-On-Module Standard
  • CB70C: VITA 59 RCE: Rugged COM Express in process
    • With conduction cooling cover and frame
    • Rugged COM Express Basic, Module Pin-out Type 6
  • CB70: PICMG COM.0 COM Express Module Base Specification
    • Without conduction cooling wings, without cover and frame
    • COM Express Basic (135 mm x 105 mm), Module Pin-out Type 6
Electrical Specifications
  • Supply voltage
    • +12V (9 to 16 V)
    • +5V (-5%/+5%) standby voltage
  • Power consumption
    • 48 W typ./ 70 W max.
    • 1.1 W in standby operation
Mechanical Specifications
  • Dimensions:
    • 135 mm x 105 mm x 18 mm (height) (conforming to VITA 59 RCE Basic format), PCB mounted between a cover and a frame (model 15CB70C00/15CB70C01)
    • 125 mm x 95 mm (conforming to PICMG COM.0 COM Express Basic format) (model 15CB70-00)
  • Weight:
    • 460 g (model 15CB70C00/15CB70C01)
    • 90 g (model 15CB70-00)
Environmental Specifications
  • Temperature range (operation): -40..+85°C Tcase (Rugged COM Express cover/frame)
  • Temperature range (storage): -40..+85°C
  • Cooling Concept
    • Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in process
    • Air-cooled versions according to PICMG COM.0 COM Express standard
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +3000 m
  • Shock: 50 m/s², 30 ms (EN 61373)
  • Vibration (function): 1 m/s², 5 Hz - 150 Hz (EN 61373)
  • Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 61373)
  • 415 714 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Flammability (PCBs)
  • UL 94 V-0
  • EMC behavior depends on the system and housing surrounding the COM Express module.
  • The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
Software Support
  • Windows
  • Linux
  • For more information on supported operating system versions and drivers see Software.
BIOS/Boot Loader
InsydeH2O UEFI Framework

Ordering Information

Related Hardware
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MDIS5 System (and Device Driver) Package (MEN) for Linux. This software package includes most standard device drivers available from MEN.


MDIS5 low-level driver sources (MEN) for generic SMBus driver


MDIS5 low-level driver sources (MEN) for board management controller on MEN Intel CPUs


Linux driver (MEN) for RX8581/RX-8574 real-time clock for all products with an additional RTC component. Please note that this driver is already included in upstream Linux kernels starting from 3.14!


Windows Embedded Standard 7 BSP


Windows 7/8 64-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S


Windows 7/8 32-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S


Windows Intel Management Engine Driver (Intel) for G22, F22P and CB70C


Windows 64-bit network driver (Intel)


Windows 32-bit network driver (Intel)


Windows ERTC/SMB support package


Windows chipset driver (Intel) for F14, F15, F17, F18, F18E, F19P, F21P, F22P, G20, G22, XM2, CB70C, D9, D6, D7, D601, A19 and A20

This product includes a specially adapted BIOS.

MEN Firmware Update Package (Intel Management Engine) for A22, BC70M, BL70E, BL70S, BL70W, CB70, CB70C, F22P, F22C, G22, G22C, MH70I


System BIOS for CB70C and CB70

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