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PX3 - MVB Interface Card
PCI Express Mini Card
PX3 is an MVB Multifunction Vehicle Bus to PCIe Mini Card interface and consists of an MVB controller, a local CPU and a PCIe Mini Card slave interface.
PX3 Mini PCI Express MVB Interface Card
Main Features
- 32-bit RISC Processor<br />MVB Interface EMD/ESD+ according to IEC 61375 (TCN Standard)<br />MVB Bus Administrator<br />4096 Process Data ports<br />Message Data stack<br />Driver support for WinXP, Win7 32/64bit and Linux<br />-40°C to +85°C
Technical Data
- Data rate: 1.5 Mbit/s
- Data frame size: 16 - 256 bits
- Cyclic transmission of process data (PD) (broadcast)
- Control and status information
- Periodic broadcast communication: 16-512 ms, 1 ms possible (real-time)
- Up to 4096 telegrams (ports), at max. 32 bytes each
- Event driven message data transfer (MD) (point-to-point)
- For online diagnostics, passenger information in normal operation
- For firmware download and collecting debugging data in field service
- On demand communication
- Destination addressed
- Response time: > 0,5 sec
- Bus Administrator communication manager (BA)
- Synchronous, time-multiplexed communication
- Transmission data sequence organization (master_frame - slave_frame)
- Full redundancy support
- Physical layers
- ESD + (Electrical Short Distance) or EMD (Electrical Middle Distance)
- 200 m (ESD+ and EMD), 32 nodes
- Galvanic isolation
- Compliant to TCN standard IEC 61375
- MVB Connectors
- Two 9-pin D-Sub interfaces via cable connected to the PCIe Mini Card
- Both male (MVB 1) and female (MVB 2) D-Sub connectors
- M3 metric inner threading
- One PCIe 2.0 Gen1 compliant lane (2.5 Gbps), x1
- For data communication path between PX3 and host
- 16 MB SDRAM
- 8 MB Flash
- MDFULL
- Passive interface
- Communication capabilities: PD and BA
- SERVER
- Active interface
- Communication capabilities: PD, MD and BA
- Reset Mechanism
- Onboard under-voltage supervision circuitry
- Power Up (PLD Loading)
- Automatically loads the PLD chips after power-on
- Dimensions (L x W x H): 51 mm x 30.2 ±0.1 mm x 12.5 mm
- Weight Mini PCI Express card: 18 g
- Weight MVB assembly: 14 g
- Temperature range (operation): -40..+85°C
- Relative humidity: max. 95%
- Altitude: Max 1800 m
- Shock: 50 m/s² (duration 50 ms)
- Vibration:
- 2 mm for 5 - 25 Hz
- 50 m/s² for 25 - 150 Hz
- RFI susceptibility from 0,15 to 2000 MHz: 20 V/m (class FS2 in EN 50155)
- Windows 7
- Linux (tested with Ubuntu 14.04 LTS)
- For information on additional operating systems, please contact our sales staff.
- For more information on supported operating system versions and drivers see Software.
- EN 50121-3-2:2006: Electromagnetic compatibility
- IEC 61375-1:2007: MVB physical layer isolation
- EN 50155:2007 12.2.9: Isolation measurement test/voltage resistance test
- EN 50155:2007 4.1.3: Shock and vibration
- IEC 61375-1:2007: MVB (Clause 3, Multifunction Vehicle Bus)
- EN 60068-2-30:2006: Humidity
Ordering Information
MVB ESD+ Device, Process Data, -40 to +85°C with qualified components, conformal coating
MVB ESD+ Device, Process and Message Data , -40 to +85°C with qualified components, conformal coating
MVB ESD+ Bus Administrator, Process Data, -40 to +85°C with qualified components, conformal coating
MVB ESD+ Bus Administrator, Process and Message Data , -40 to +85°C with qualified components, conformal coating
MVB EMD Device, Process Data, -40 to +85°C with qualified components, conformal coating
MVB EMD Device, Process and Message Data , -40 to +85°C with qualified components, conformal coating
MVB EMD Bus Administrator, Process Data, -40 to +85°C with qualified components, conformal coating
MVB EMD, Bus Administrator, Process and Message Data , -40 to +85°C with qualified components, conformal coating