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CC10C - Rugged COM Express with ARM i.MX 6

VITA 59 RCE Module

The CC10C is a VITA 59 Rugged COM Express type 6 module using an NXP (formerly Freescale) ARM i.MX 6 CPU with a Cortex-A9 architecture and an onboard FPGA for flexible, customizable I/O.

Download data sheet

  • CC10C Product ImageCC10C Rugged COM Express (VITA 59 RCE) with ARM i.MX 6
  • CC10C Product ImageRugged COM Express Compact module with Rugged COM Express frame and cover
  • CC10C Product ImageCC10 COM Express model
  • CC10C Product ImageCC10C Rugged COM Express Basic module inside Rugged COM Express frame and cover
  • CC10C Product Image
  • CC10C Product Image
  • CC10C Product Image
  • CC10C Product Image

Main Features

  • NXP ARM i.MX 6 Series
  • Quad-core processor
  • Comprehensive usage of i.MX 6 I/O
  • Configurable FPGA I/O with 140 pins
  • Maximum flexibility in interface configuration
  • Up to 4 GB DDR3 SDRAM
  • eMMC multimedia card
  • U-Boot Universal Boot Loader
  • -40°C to +85°C Tcase qualified
  • Conduction cooling
  • VITA 59 in process, compliant with COM Express Compact, type 6
  • PICMG COM.0 COM Express version also available
CC10C Product Image

Technical Data

CPU
  • NXP ARM i.MX 6 Series (ARM Cortex-A9 architecture)
  • The following CPU types are available:
    • i.MX6S (i.MX 6Solo family)
    • i.MX6DL (i.MX 6DualLite family)
    • i.MX6D (i.MX 6Dual family)
    • i.MX6Q (i.MX 6Quad family)
  • See overview of supported processor types for processor options and a feature matrix of the i.MX 6 series.
Memory
  • System Memory
    • Soldered DDR3
    • 1 GB, 2 GB, or 4 GB
  • Boot Flash
    • 4 MB, 8 MB, or 16 MB
Mass Storage
The following mass storage devices can be assembled:
  • eMMC device, soldered; different sizes available
Graphics
  • Integrated in i.MX 6 processor
  • Multi-stream-capable HD video engine delivering up to 1080p60 decode, 1080p30 encode and 3D video playback in HD
  • Maximum resolution: 1920 x 1200 pixels (WUXGA)
  • Superior 3D graphics performance with up to four shaders performing 200 Mt/s and OpenCL support
  • Separate 2D and/or OpenVG Vertex acceleration engines for optimal user interface experience
  • Stereoscopic image sensor support for 3D imaging
Onboard Interfaces
  • Available via COM Express connectors
  • Video
    • One HDMI/DVI interface
    • One LVDS interface, dual-channel
    • One MIPI CSI-2 camera serial host interface; optional
  • Audio
    • One AC'97 audio interface
    • One I2S audio interface
  • SATA
    • One channel, SATA Revision 2.x (3 Gbit/s); only with i.MX6D or i.MX6Q
  • SDIO/SDHC
    • One channel for MMC/SD/SDIO cards
  • USB
    • Two host channels, USB 2.0 (480 Mbit/s), or
    • Six host channels, USB 2.0 (480 Mbit/s)
    • One channel always implemented as OTG (On-The-Go) host/client channel
  • Ethernet
    • One channel, 1000BASE-T (1 Gbit/s)
    • One channel, 100BASE-T (100 Mbit/s); optional
    • Two link and activity LED signals per channel
  • PCI Express
    • One x1 link (250 MB/s per link), PCIe 1.1 (2.5 Gbit/s per lane)
  • ExpressCard
    • One interface
  • CAN bus
    • Two CAN bus channels, 2.0B CAN protocol, 1 Mbit/s
    • Two additional CAN bus channels, 2.0A/B CAN protocol, 1 Mbit/s; with FPGA; optional
    • External transceivers to be implemented on carrier board
  • UART
    • Up to six interfaces, up to 4 Mbit/s
    • Physical interfaces RS232 or RS422/RS485 depending on interface controller and implementation on carrier board
  • PWM
    • Three PWM interfaces
  • I2C
    • Up to four I2C interfaces
  • SPI
    • Up to three SPI interfaces
  • COM Express control signals
    • Four COM Express control signals
  • GPIO
    • 9 GPIO lines, 4 GPO lines, 3 GPI lines
    • 64 GPIO lines, with FPGA; optional
FPGA
  • No FPGA assembled, with custom configuration of i.MX 6 I/O interfaces, or
  • FPGA Altera Cyclone IV, with custom IP core and i.MX 6 I/O configuration
    • Total available pin count: 140 pins on COM Express connectors
  • The IP cores that make sense and/or can be implemented depend on the board model, available pin counts and number of logic elements. Please contact MEN for information on feasibility.
Supervision and Control
  • Power supervision and watchdog
  • Temperature measurement
    • i.MX 6 temperature measurement
    • Additional onboard temperature sensor; optional
  • Real-time clock, with supercapacitor or battery backup on the carrier board
Computer-On-Module Standard
  • CC10C: VITA 59 RCE: Rugged COM Express in process
    • With conduction cooling cover and frame
    • Rugged COM Express Compact, Module Pin-out Type 6
  • CC10: PICMG COM.0 COM Express Module Base Specification
    • COM Express Compact, Module Pin-out Type 6
Electrical Specifications
  • Supply voltage
    • +12 V (9 to 16 V)
  • Power consumption
    • 12 W, measured in stress test using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 7.4 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 5 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10-00, i.MX6S single-core @ 800 MHz
Mechanical Specifications
  • Dimensions
    • 105 mm x 105 mm x 18 mm (models conforming to VITA 59 RCE Compact format, PCB mounted between a cover and a frame)
    • 95 mm x 95 mm (models conforming to PICMG COM.0 COM Express Compact format)
  • Weight
    • 356 g (model 15CC10C00)
    • 40 g (model 15CC10-00)
Environmental Specifications
  • Temperature range (operation)
    • -40°C to +85°C Tcase (VITA 59 cover/frame) (qualified components) (model 15CC10C00)
    • -40°C to +85°C (qualified components) (model 15CC10-00)
  • Temperature range (storage): -40°C to +85°C
  • Cooling concept
    • Conduction-cooled (models conforming to VITA 59 RCE Compact format, PCB mounted between a cover and a frame)
    • Air-cooled (models conforming to PICMG COM.0 COM Express Compact format)
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +3000 m
  • Shock: 50 m/s², 30 ms (EN 61373)
  • Vibration (function): 1 m/s², 5 Hz to 150 Hz (EN 61373)
  • Vibration (lifetime): 7.9 m/s², 5 Hz to 150 Hz (EN 61373)
  • Conformal coating; optional
Reliability
MTBF
  • 652 986 h @ 40°C according to IEC/TR 62380 (RDF 2000) (model 15CC10C00)
  • 1 233 470 h @ 40°C according to IEC/TR 62380 (RDF 2000) (model 15CC10-00)
Safety
Flammability
  • UL 94V-0
EMC
  • EMC behavior generally depends on the system and housing surrounding the COM module.
  • The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
Software Support
  • Linux
  • VxWorks
  • For more information on supported operating system versions and drivers see Software.
BIOS
U-Boot Universal Boot Loader

Ordering Information

Standard CC10C Models
15CC10-00

COM Express "Compact", type 6, Freescale i.MX6S, 0.8 GHz, 1 GB RAM, 4 GB eMMC, 2 USB, 1 Gb ETH, no FPGA, -40..+85°C with qualified components; without VITA 59 conduction cooling frame

15CC10C00

Rugged COM Express "Compact", type 6, Freescale i.MX6Q, 1 GHz, 2 GB RAM, 4 GB eMMC, 6 USB, 1 Gb Ethernet, 1 Fast Ethernet, PCIe 1.1, with FPGA, -40..+85°C Tcase with qualified components; with VITA 59 conduction cooling frame

Related Hardware
08XC15-01
XC15 - Rugged COM Express Carrier Board

XC15, evaluation and development board for CC10C VITA59 RCE module, dual channel LVDS, 1 HDMI, 1 HD audio AC97, 1 GB Ethernet, 1 SATA connector, 4 USB 2.0, 1 USB OTG, 1 RS232 (second UART with additional SA-Adapter), 2 CAN bus, 1 SD card slot, 1 PCI Express card slots x1, 1 PCIe Mini Card slot (USB2.0), audio, 0..+60°C

Details

Software

Linux
10CC10-90

Linux BSP (MEN) for CC10C, CC10 and CC10S

13Z100-91

Linux FPGA update tool (MEN)

13MD05-90

MDIS5 System (and Device Driver) Package (MEN) for Linux. This software package includes most standard device drivers available from MEN.

VxWorks
10CC10-60

VxWorks BSP (MEN) for CC10C, CC10 and CC10S

13Z100-60

VxWorks FPGA update tool (MEN)

13MD05-60

MDIS5 System Package (MEN) for VxWorks. This software package includes most standard device drivers available from MEN.

13Z017-06

MDIS5 low-level driver sources (MEN) for 16Z034_GPIO, 16Z037_GPIO and 16Z127_GPIO

Firmware/BIOS
This product uses the U-Boot bootloader available from DENX together with board-specific additions from MEN.
14CC10-00

U-Boot Bootloader (DENX/MEN) for CC10C, CC10 and CC10S